LMC3200G removes the low-k material and metal pattern layers on the wafer sawlane.
It not only improves the yield rate but also reduces wafer chipping during
the blade dicing processing.
LMC3200D is a dicing system for thin wafer of less than 200㎛.
It is better than mechanical blade dicing system in terms of COO, sicne it doesn’t need to replace
blade and the lifetime of laser parts is long and semipermanent.
The non-contact process can dramatically reduce the problem of chipping and enable high-speed