Molding equipment for R&D and mass production with advanced technology for QFN and power devices for consumable and automotive applications.


Test handlers for IC devices particularly QFN and motion sensors with capability to test in ambient, hot and cold temperatures. Highest UPH pick-and-place system for sorting devices from wafer rings of bare die or molded QFN devices on film frames.


Total solution provider for laser marking, engraving and wafer grooving.

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