Leader in bonding wires (copper, gold and alloy) and solder balls for IC devices.
An essential material for manufacturing semiconductor that connects lead and silicon chips to transmit electricalsignals. A fine wire that is about ¼ the thickness of hair and requires high-strength ultra precision technology and a special technology to endure high temperatures for a long time.
GOLD BONDING WIRE
SILVER BONDING WIRE
ALUMINUM BONDING WIRE
COPPER BONDING WIRE
Solder Ball is an electronic solder part that attaches semiconductor chips, circuit modules, and PCB boards in high-integration packaging technologies of BGA, CSP, and WLCSP to transmit electrical signals.