TS-PRO : Applying back tape after wire-bonding

Categories : I-PEX

The TS-PRO has the No.1 market share as a machine adopted by major Outsourced Semiconductor Assembly and Test (OSAT) companies, particularly in Taiwan, China and Japan.

Using I-PEX unique taping technology (patented), quality and cost issues regarding the QFN package can be improved, traditionally associated with the pre-tape method. The TS-PRO WIDE is also available with a frame width of 100 mm for HD.


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