Molding equipment for R&D and mass production with advanced technology for QFN and power devices for consumable and automotive applications.

GP-PRO SP Molding System : An automatic molding system for mass production

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TS-PRO : Applying back tape after wire-bonding

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Realization of labor savings in the De-TAPE process

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Mold Chase : Precision molds for semiconductor packaging

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I-PEX LOCAL SERVICE ENGINEER

For more than 40 years, we have supplied the world with automatic molding equipment that is produced in Japan and boasts a high level of excellence.

The local support system in Asian countries is also well-equipped, giving peace of mind to customers who use our products.

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