MAP Picker (4605-HTR)

4605-HTR     Die Sorter Tape & Reel


The 4605-HTR is the latest model of die sorting handler which dramatically improves the UPH as 30,000 from previous model 3905-HTR. 
The WLCSP requires high accuracy for vision inspection. Tesec prepares the latest vision system for the WLCSP.

4605-HTR is a MAP Sorter which picks up devices from wafer ring and sorts to tape or bin according to the MAP file created by film frame test handler or prober. 
4605-HTR is a high speed handling system, available for 12 inches wafer rings. When used in combination with 4170-IH, 4605-HTR much improves efficiency in testing process of leadless devices as a high speed sorting machine.

 4605-HTR

 

Model

4605-HTR

 Applicable Package

WLCSP, QFN, DFN, CSP, BGA, BCC, LLP

 Applicable Ring Size

8 / 12 inch

Max Throughput (pc/h)*

30,000

 Cycle Time (s/pc)

0.12

 Feeding

1 cassette (25 wafer rings)

 Sorting

Tape and Reel 1, Bin

Vision Inspection system

6side, In-Pocket, Post Seal

* Please contact us for the detail specification.
*Theoretical throughput disregarding ring replacement. The value differs by device matrix on strip.

 

More Information =>>

4605-HTR     Die Sorter Tape & Reel


The 4605-HTR is the latest model of die sorting handler which dramatically improves the UPH as 30,000 from previous model 3905-HTR. 
The WLCSP requires high accuracy for vision inspection. Tesec prepares the latest vision system for the WLCSP.

4605-HTR is a MAP Sorter which picks up devices from wafer ring and sorts to tape or bin according to the MAP file created by film frame test handler or prober. 
4605-HTR is a high speed handling system, available for 12 inches wafer rings. When used in combination with 4170-IH, 4605-HTR much improves efficiency in testing process of leadless devices as a high speed sorting machine.
  

 

http://en.tesec.co.jp/products/4605htr/?action=common_download_main&upload_id=1292

 

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http://en.tesec.co.jp/products/4605htr/?action=common_download_main&upload_id=30

Model

4605-HTR

 Applicable Package

WLCSP, QFN, DFN, CSP, BGA, BCC, LLP

 Applicable Ring Size

8 / 12 inch

Max Throughput (pc/h)*

30,000

 Cycle Time (s/pc)

0.12

 Feeding

1 cassette (25 wafer rings)

 Sorting

Tape and Reel 1, Bin

Vision Inspection system

6side, In-Pocket, Post Seal

* Please contact us for the detail specification.
*Theoretical throughput disregarding ring replacement. The value differs by device matrix on strip.